| 摘要 |
<p>PURPOSE:To prevent function damage to a device based on the damage to end edge sections by rigidly forming both end edges of a glass tube substance sealing a semiconductor pellet. CONSTITUTION:A semiconductor pellet 3 is inserted in a glass tube 1 and metallic leads 2a, 2b are oppositedly arranged by keeping a predetermined interval L. The semiconductor pellet 3 is adhered to the leads 2a, 2b by heating the glass tube 1. The leads 2a, 2b are immediately moved in the directions of arrows, A, B to hold the pellet 3 at an end surface 2c. The inside adhesion section of both the end edges 1a, 1b of the glass tube 1 will be deformed in a shape encroaching in the inside and the end edges 1a, 1b increased a cross section by a fat face will be obtained. Therefore, the end edges will not be damaged by the thermal expansion of the leads or the like and the reliability of a device will be improved.</p> |
