| 摘要 |
PURPOSE:To attempt the improvement of reliability by making broad and shallow grooves on the scribe line of a semiconductor wafer from the inside of the wafer wherein a backing electrode is provided and the semiconductor wafer is soldered by using the backing electrode after scribing the semiconductor wafer from the surface. CONSTITUTION:Shallow grooves 12 are made by dicing with a broad blade from the indide of a wafer 11. Next, a Cr-Au-Cr backing electrode 13 is evaporated to split the wafer into a pellet 14 by scribing the wafer from the surface. Next, thermo compression is applied to a header 15 through solder. In this composition, the thickness of solder will be controlled. Thick layer of the solder relieves thermal distortion and the speed of soldering oxide fatigue will be improved. |
