| 摘要 |
PURPOSE:To largely reduce the number of bonding processes by pluralizing the number of bonding heads. CONSTITUTION:A first capillary K1 is formed by thermally press-bonding an Au wiring to a first bonding pad P1, then extending the first bonding wiring W1 of the Au wiring, thermally press-bonding it to the end of a first inner lead l1, and cutting the end. Then, the capillary K1 is sequentially moved while bonding it from second to sixth bonding pads P2...P6. A second capillary K2 is formed by thermally press-bonding the Au wiring to a seventh bonding pad P7 next to one magnification of 12/2 simultaneously with the process of thermally press-bonding it to the pad P1, extending the wiring W7 and thermally press- bonding to the end of seventh inner lead l7. Similarly, eighth-twelfth bonding pads P8-P12 are wire bonded to the ends of inner leads l8-l12 corresponding to the capillary K1. Accordingly, the time of completing the wire bonding of twelve bonding pads can be reduced by half. |
