| 摘要 |
PURPOSE:To dispense with nickel plating and prevent leakage by composing a glass terminal, which is fitted into a through hole made in a copper stem for a semiconductor device, of an iron eyelet plated with copper all over and a lead wire airtightly sealed in the eyelet via glass. CONSTITUTION:In a through hole 7 made in a copper stem 5 for a semiconductor device, a glass terminal 1 is fitted and airtightly sealed, and at this time, the shape of the glass terminal 1 is made as follows. An iron eyelet 2 is plated with a copper layer 11 of 3-12mum thick all over, and in its center, a lead wire 4 is arranged, and between the lead wire and the eyelet, glass 3 is filled. For the glass 3, soda barium glass powder of the like and organic binder are used and sealing is performed by heat-treating in a neutral atmosphere at about 1,000 deg.C. Then the eyelet 2 is fitted into the through hole 7 of the stem 5 and calked mechanically. By so doing, nickel plating can be omitted and the process is simplified. |
