Dual element semiconductor device - has both elements soldered between respective supply electrodes and metal housing parts and encapsulated

摘要

The semiconductor element (1a) of the device is soldered between a metal housing part (4) and a supply electrode (5a), being enclosed by plastics (7a) which also covers the adjacent parts of the electrode. The plastics encapsulation reaches up to the metal housing part. The device contains a second semiconductor element (1b) soldered between a second supply electrode (5b) and the metal housing part. This assembly is also enclosed by plastics (7b), arranged in a similar manner as that round the first semiconductor element. The metal housing part has perforations (6), via which the two plastics masses are interconnected. The perforations may be in the form of cylindrical bores and the metal housing part may be in the form of a plane-parallel plate. The device has the advantage of being pressure-stabilised. The two semiconductor elements may be silicon diode chips.