发明名称 |
PROCESS FOR METALPLATING ALUMINIUM SUBSTRATE |
摘要 |
A method of plating a metallic substrate by coating said substrate with a specific metallic system; plating at least one metal onto the coating; and heating the coated and plated metallic substrate to a temperature that effects a bonding of said metallic substrate to said coating and the plated metal. The method is utilized to plate metals onto metal substrates; including substrates such as aluminum and zinc. |
申请公布号 |
CS205020(B2) |
申请公布日期 |
1981.04.30 |
申请号 |
CS19760002544 |
申请日期 |
1976.04.16 |
申请人 |
STAUFFER CHEMICAL CO.,US |
发明人 |
COLL-PALAGOS,MIGUEL,US |
分类号 |
C25D5/30;C23C10/28;C23C18/52;C23C26/00;C25D5/10;C25D5/34;C25D5/44;C25D5/50;(IPC1-7):C25D5/10 |
主分类号 |
C25D5/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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