发明名称 PROCESS FOR METALPLATING ALUMINIUM SUBSTRATE
摘要 A method of plating a metallic substrate by coating said substrate with a specific metallic system; plating at least one metal onto the coating; and heating the coated and plated metallic substrate to a temperature that effects a bonding of said metallic substrate to said coating and the plated metal. The method is utilized to plate metals onto metal substrates; including substrates such as aluminum and zinc.
申请公布号 CS205020(B2) 申请公布日期 1981.04.30
申请号 CS19760002544 申请日期 1976.04.16
申请人 STAUFFER CHEMICAL CO.,US 发明人 COLL-PALAGOS,MIGUEL,US
分类号 C25D5/30;C23C10/28;C23C18/52;C23C26/00;C25D5/10;C25D5/34;C25D5/44;C25D5/50;(IPC1-7):C25D5/10 主分类号 C25D5/30
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