| 摘要 |
PURPOSE:To obtain the titled polishing liquid with excellent adhesiveness of a plated film after treatment by adding hydrochloric acid and orthophosphoric acid with a specific concn. to an aqueous sulfuric acid solution with a specific concn. CONSTITUTION:To the aqueous sulfuric acid solution with a concn. range of 0.02- 1mol, hydrochloric acid with a concn. range of 0.15-0.3mol and the orthophosphoric acid with a concn. range of 0.2-0.4mol are added to prepare the chemical polishing liquid for the invar. The concn. of sulfuric acid in this polishing liquid is lowered by adding an additive liquid, but the concn. thereof is maintained to 0.02- 0.1mol. If the invar is chemically polished by this aqueous solution, the surface thereof becomes smooth and the adhesiveness of a plated film is enhanced. |
