发明名称 MOLD FOR THERMOSETTING SYNTHETIC RESINNMOLDING
摘要 PURPOSE:To provide a mold free of the production of air bubbles in thermosetting resin and reduction in insulation or the like, by a method wherein a vacuum suction is performed by providing a resin gathering cavity, which is connected to a cavity, in a location being positioned opposite to that of a resin pouring hole. CONSTITUTION:An object 4 to be molded is previously supported in a hollow of a cavity 17 by means of a core 5, and the inside of the cavity 17 is brought into a vacuum state. Compressed air is then fed into a raw material tank 6, and a liquid thermosetting resin 7, whose air is let out, is fed by pressure into the cavity 17 with valves 10 and 12 opened. The cavity is fully filled with the resin for a short period of time without the production of air bubbles due to the vacuum state in the cavity 17. The thermosetting resin 7, wherewith the cavity 7 is fully filled, flows into a resin gathering cavity 20. The thermosetting resin 7 is gelled by heating by means of a heater 25 thereupon. A pouring head valve 12 is closed, a vacuum pump 23 is detached, a mold 16 is unlocked, and a molded product is then unloaded.
申请公布号 JPS5646716(A) 申请公布日期 1981.04.28
申请号 JP19790122818 申请日期 1979.09.25
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 TAKEDA TAMIO;KOBAYASHI YASUYUKI
分类号 B29C45/00;B29B7/00;B29C39/00;B29C39/10;B29C39/24;B29C39/26;B29C39/42;B29C43/00;B29C45/02;B29C45/14;B29C45/26;B29K101/10;B29K105/20;B29K105/34;B29L31/34;H01L21/56 主分类号 B29C45/00
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