| 摘要 |
<p>PURPOSE:To facilitate handling of a package so as to improve the packaging factor by a method wherein external terminals, which are formed out of high melting metal and connected to a wiring of a mounting substrate, are provided to the rear of the package. CONSTITUTION:A ceramic package is composed of three-layered ceramic substrates SUB1-SUB3 which are sintered into one piece. A metal layer is formed on a part (center) of the surface of the substrate SUB1 for wire-bonding of a semiconductor integrated chip IC(LSI) to it. An electrode which is connected with the above IC through wire-bonding and a wiring pattern which leads the electrode out to an external terminal are formed on the surface of the substrate SUB2. An electrode which is connected with an external electrode is provided to the face of the substrate SUB2 which is contacted with the rear of the substrate SUB3. The above electrode is made to be connected with the corresponding wiring formed on the substrate SUB2. These electrode layers are formed out of a high melting metal such as W or the like. A cap is provided to the surface of the SUB3, whereby the semiconductor chip is completely sealed from the outside.</p> |
