| 摘要 |
<p>SOLDER PREFORM A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick Mat ring of an alloy comsisting of substantially 63% tin and 37% lead and having a characteristic that it solidifies from the fluid state as a homogeneous mixture. The solder preform has a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of substantially 96.5% tin and 3.5% silver. The thickness of the ring is of the order of 0.0018 inch and the thickness of the alloy coaling is of the order of 0.0001 inch.</p> |
