| 摘要 |
A method for electrochemically removing a tin layer from copper or copper alloy substrates without any attack on the substrate is disclosed which permits the simultaneous recovery of pure tin at high efficiency. The process is carried out by achieving effective complexing of tin ions in solution so that a stannous ion activity of greater than 10-4 gm ions/l is never achieved while conducting the electrochemical detinning potentiostatically at a potential where anodic corrosion of the copper or copper alloy substrate is not possible.
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