发明名称 Method of preparing resist pattern
摘要 A method of preparing a fine and highly precise resist pattern comprising a step of forming a positive resist layer consisting of poly-(methacrylic anhydride) on a substrate, a step of irradiating the resist layer thus formed with a predetermined pattern of ionizing radiation and a step of developing the irradiated resist pattern with a developer comprising a solvent mixture composed of a polar organic solvent (A) capable of dissolving poly-(methyacrylic anhydride) and a non-solvent (B) incapable of dissolving poly-(methacrylic anhydride).
申请公布号 US4264715(A) 申请公布日期 1981.04.28
申请号 US19790094048 申请日期 1979.11.14
申请人 VLSI TECHNOLOGY RESEARCH ASSOCIATION 发明人 MIURA, AKIRA;HIDEYAMA, SHOZO;HIGASHIKAWA, IWAO
分类号 G03F1/00;G03F1/08;G03F7/039;G03F7/32;H01L21/027;(IPC1-7):G03C5/00 主分类号 G03F1/00
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