发明名称 METHOD FOR FORMING PATTERN
摘要 PURPOSE:To make the laying of photomasks on a substrate very easily by arranging the aligning mark of the third layer photomask having a pattern between the aligning marks which are prepared in the previously formed two layers, and aligning these marks. CONSTITUTION:Aligning marks M11 and M12 are provided on the first layer photomask, and printed on a substrate. Then, etching is performed, and aligning marks W11 and W12 are formed. On the second layer photomask; an aligning mark M21 which can be aligned with the mark W11 but is slightly smaller than the mark W11 is provided, and is provided an aligning mark M22, whose size is smaller than the mark W12 and such that the aligning mark of the third layer photomask can be arranged and alined in the space surrounded by the mark 12. The second photomask having said marks M21 and M22 are printed on the substrate. Then, etching is performed, and the aligning marks W21 and W22 are formed. An aligning mark 31 which can be aligned with the marks W12 and W22 is provided on the third layer photomask. Stacking is made on the substrate so that the mark M31 is aligned with the marks W12 and W22, and printing and etching are performed.
申请公布号 JPS5646528(A) 申请公布日期 1981.04.27
申请号 JP19790120850 申请日期 1979.09.21
申请人 OKI ELECTRIC IND CO LTD 发明人 KANAMORI JIYUN;YOKOYAMA TAKASHI;TOMINAGA YUKIHIRO
分类号 G03F9/00;H01L21/027;H01L21/30;(IPC1-7):01L21/30 主分类号 G03F9/00
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