| 摘要 |
PURPOSE:To simplify the alignment of a semiconductor integrated circuit device and to improve its thermal fatigue characteristics by providing a step between the electrically connecting terminals and the geometry-controlling connecting terminals on a substrate. CONSTITUTION:A spacer 10 is provided on a substrate 3 by printing insulator to make a step h. Connecting terminal 5 are printed on the substrate 3 so that the spacer 10 is inside an IC chip 1 and the terminals 5 correspond to solder bumps 2 for electrical connection and solder bumps 6 for geometry control. After alignment, the terminals 5 and the bumps 2 and 6 are connected on melting. On doing this, the final connecting height of the chip 1 to the substrate 3 is maintained by the geometry controlling bumps 6. Therefore, each electrical connecting portion 4 is extended into a column, which has excellent thermal fatigue characteristics. Properly setting the volume of the bumps 2 and 6, the terminal dimension and the step h provides connecting portions having arbitrary geometry. The constitution permits improvement in the thermal fatigue of the solder connecting portion, and mass production of an IC device. |
