| 摘要 |
PURPOSE:To obtain a uniform resin film-thickness by applying photo resin to a semiconductor substrate before exposing it in an organic solvent atmosphere. CONSTITUTION:A semiconductor substrate is sent from a sender 9 to a spinner 10, which drops photo resin on the substrate rotating. Then the substrate is sent to a surface processor 11, in which an organic solvent is continuously injected from a nozzle to make an organic solvent atmosphere in the processor 11 provided with a cover. After this state is kept for a given time, the substrate is moved to an oven 12. This permits the step amount on the resin surface to be greatly reduced, and consequently its film thickness to be uniform, so that a micro pattern is readily formed. |
