Heat-sink mounted hybrid circuit module assembly - fits items into interlocking stack complete with electrical connections and insulation spacers

摘要

Integrated circuit modules of identical type may be assembled into a stack forming a complete installation element. The stack comprises heat sink units and insulation spacer units (15) separating the heat sinks. The heat sink has a flat surface (12) onto which several hybrid thin film integrated circuits are mounted. One edge of the plate is thickened to form a block (30) through which heat from the circuits is conducted away, either direct to air or to a common cooler for the complete stack. The insulation spacer (15), typically a plastic moulding, forms a frame which locates on adjacent heat sinks. It carries connector pins (14) which make electrical plug contact with the integrated circuit assembly on the plate (12). It also has a cut out (34) for the heat sink block.