发明名称 LEAD FRAME
摘要 PURPOSE:To obtain the lead frame which has necessary various characteristics and its mass production is easy by a method wherein a specified stainless base material is solid phase-welded or plated with copper, etc. and a laminated material is formed, and the material is press-worked or etching-worked to the desired form. CONSTITUTION:The laminated material 8 is formed in such a manner that both sides or one side of the stainless base material 5 is solid phase-welded or plated with copper or copper alloys 6, 7 having excellent pyroductivity, electric conductivity and plating property using SUS410 or SUS430 as the base material 5. The laminated material 8 is press-worked or etching-worked, and the lead frame 9 with the desired shape is prepared. Thus, the lead frame can be obtained whose thermal expansion is little, surface treatment is easy, has corrosion resistance, is excellent in strength at a high temperature, electric conductivity and pyroductivity, its mass production by means of press work is enabled and is cheap.
申请公布号 JPS5643747(A) 申请公布日期 1981.04.22
申请号 JP19790119538 申请日期 1979.09.17
申请人 发明人
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
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