| 摘要 |
PURPOSE:To enhance the reliability of the IC by forming a conductive pattern provided on a substrate of a porous metallized layer immersed with low resistance solder in a flat ceramic package and forming the connecting portion with an external lead terminal of double structure of dense and porous metallized layers. CONSTITUTION:When the IC chip 2 is secured into a die cavity 3 formed at a ceramic base 1 forming a flat type ceramic package, it is secured through a dense W metallized layer 13 in normal way. Then, the electrode of the chip 2 is connected to the conductive pattern 31 on the base 1 by using a fine wire 6. At this time the pattern 31 is formed of porous W metallized layer 31 immersed with low resistance silver solder. When connecting an external lead terminal 5 to the end of the pattern 31, a dense W metallized layer 31' is interposed therebetween. Thus, there can be obtained a package of good electric conductivity and adherence. |
