| 摘要 |
PURPOSE:To enhance mass production of the solid state color image pickup element board by simultaneously bonding a number of arrayed color separation filters with the same number of solid image pickup elements arranged when forming the color solid image pickup element board integrated by bonding the color separation filters on the solid image pickup elements. CONSTITUTION:A number of solid image pickup element 23 are arrayed on an Si wafer as a solid image pickup element substrate 31, and a number of mosaic shape or stripe shape color separation filters 26 are arranged corresponding to the picture elements of the elements 23 as a color separation filter substrate 22. Then, grooves 22b are opened correspondingly to the bonding pad portion 25 of the elements 23 on the surface of forming the filters 26 of the filter substrate 22, and the substrates 21 and 22 are bonded using an adhesive which is hardened by irradiating ultraviolet rays or heat treatment. Thus, it can be manufactured in mass production, and the dusts adhered when bonding them are introduced into the grooves 22b, and improper bonding can be eliminated. |
