| 摘要 |
PURPOSE:To increase a reliability by operating the laser light for working and that for recognizing, detecting the reflection light emitted from the fuse to be worked of the laser light for recognition and deciding the good and no good of the fuse working based on the variation in the intensity of the reflection light before and after working. CONSTITUTION:The laser light 13 for working outputted from the laser oscillator 2 for working is reflected by a half mirror 4 via an attenuator 3 and projected on the wafer 1 to be worked by an objective lens 5. A fuse is cut with its exothermic sablimation by the laser light 13 image-formed on the fuse to be cut of the wafer 1 positioned by a stage driver 7. The laser light 14 for recognition of low power outputted from the laser oscillator 9 for recognition passes the same optical axis as that of the laser light for working and is made incident on a detector 12 after reflecting on the surface of the fuse to be worked. The intensity of the reflection light is measured by the detector 12 and in case of the cutting being found incomplete the position adjustment and reworking are commanded again to a controller 8. The semiconductor device having a high reliability can thus be manufactured. |
