| 摘要 |
PURPOSE:To raise the packaging density of a semiconductor device by encasing a semiconductor chip in a package formed by an insulative substrate of ceramic or the like as well as providing a chip on the lower surface of the cap of the same material so that the packaging is three-dimensional. CONSTITUTION:On an insulative substrate 1 of ceramic, wirings 2 of Au or the like are provided according to a given pattern. A semiconductor chip 4 is secured to one of the wirings 2 by using a bonding agent 3. Bonding pads 5 of the chip 4 and adjacent wirings 2 are connected by wires 6, and lead terminals 7 penetrating through the substrate 1 are connected to the adjacent wirings 2. Then, a cap 11 of ceramic, which has the same circuit as the element circuit formed on the substrate 1 downwards in a concave room 12, is put on the substrate 1, and the ends of the substrate 1 and the cap 11 are joined by using bonding agents 8 and 9. Thus, two chips 4 are encased in one package. |
