| 摘要 |
Means are provided to repair one or more flash lamps in a linear type photoflash lamp array which have become disconnected from the circuit board member. Specifically, the disconnected in-lead is secured to the sequential firing circuitry located on the circuit board member with an adhesive deposit of an organic polymer and a surface conductive path thereafter established on said adhesive deposit between the in-lead and the adjacent circuitry. The surface conductive path can also be an organic polymer containing an electrically conductive filler.
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