发明名称 |
Microcircuit package formed of multi-components |
摘要 |
A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.
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申请公布号 |
US4262300(A) |
申请公布日期 |
1981.04.14 |
申请号 |
US19780957094 |
申请日期 |
1978.11.03 |
申请人 |
ISOTRONICS, INC. |
发明人 |
SCHERER, JEREMY D. |
分类号 |
H01L21/50;H01L23/057;(IPC1-7):H01L23/02;H01L23/12;H01L39/02 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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