发明名称 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the high speed feeding of frames by an apparatus wherein a tape made of conductive material is laid upon a film carrier to apply an added tensile force. CONSTITUTION:When a film carrier 21 is fed through the frame feeding in the direction as shown by an arrow, the displacement amount of a tape 22 for applying a tensile force decreases gradually, while the tape 22 for applying a tensile force that is introduced within a vacuum chnamber 26 for preventing the slack increases its displacement amount and descends gradually. On this occasion, a position detecting sensor is started to operate and the film carrier is supplied from a reel, so that the displacement amount of the tape 22 within a chamber 23 for applying the tensile force is reduced by half again. In the vacuum chamber 26 for preventing the slack, the displacement amount of the tape is reduced and the tape is ascended, so that the supply of th film carrier from the reel is stopped by a signal from the position detecting sensor. In such a manner, when the tensile force is applied by using vacuum, there is produced no increase in a dynamic force in relation to the sudden change in acceleration of the film carrier, thereby obtaining the sufficient strength of perforations with respect to the high speed frame feeding and further the stable tensile force.
申请公布号 JPS5637641(A) 申请公布日期 1981.04.11
申请号 JP19790113323 申请日期 1979.09.04
申请人 NIPPON ELECTRIC CO 发明人 SATOU SUSUMU
分类号 H01L21/60 主分类号 H01L21/60
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