| 摘要 |
A one-piece stamped sheet-metal heat sink for dissipation of heat which accumulates about the plastic housing and metallic tab of a miniature semiconductor power device is formed as a shallow open-topped channel having short upstanding sides which flare laterally outwardly and then upwardly and then both inwardly and downwardly to bent-over inner edges spaced apart just slightly closer than the sides and inclined above the sides in position to engage top edges of a plastic semiconductor package fitting within the channel. The symmetrical unitary structure thus formed exhibits flexibility enabling its inner edges to spread apart readily as a semiconductor package is pressed into the channel and to spring back into the position where its edges engage and hold the package.
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