| 摘要 |
PURPOSE:To reduce the surface of chip of head and to increase the economy and working ability, by forming the lead pickup terminals on the different surface from the transducer forming surface. CONSTITUTION:The transducer section is constituted with the coil 27 made of the conductor layer provided on the nonmagnetic substance substrate 22 and the core 26 made of the magnetic substance layer forming the magnetic circuit. The ridge line tying the transducer forming surface and the forming surface of lead pickup terminal 23 is polished into the curved surface. The conductor pattern 20 is extended from the terminal 29 of the coil 27 and it is wired to the transducer forming rear surface of the substrate 22 through the curved surface and linked with the lead pickup terminal 23. The substrate 22 is bonded to the slider 21 via the bonding layer 28 and the lead 24 is connected to the terminal 23 to constitute the magnetic head. Thus, the chip size of the thin film magnetic head can be decreased. |
