| 摘要 |
PURPOSE:To easily perform assembling of a semiconductor IC circuit device using gang bonding method and to prevent occurrence of defective products by a method wherein a notch is provided at a section of a lead located on the side to be connected to an electrode on a semiconductor element. CONSTITUTION:A fine lead wire protruding from a semiconductor IC circuit element 2 is connected to an internal lead 1 on a lead frame. Also, notches 11 and 11', to be used as heat resistance, are provided outside the connection point of the internal lead 1. The heat is transmitted to the lead frame by a heater, the heat radiation to the outside is reduced by half at the notches 11 and 11' of the internal lead 1 and the heat is transmitted to the connected section. |
