发明名称 PHOTORESIST APPLYING APPARATUS
摘要 PURPOSE:To obtain a high-quality mask-applied film by arranging a recieving pan for a dropping resist liquid under the nozzle and preventing the dropping of unnecessary materials. CONSTITUTION:At first, the position of a resist-dropping nozzle 3 is adjusted 4 by a control signal 1 so that the nozzle 3 is located outside a rotating support 5 and directly over a receiving pan 7. A pump 2 is driven by the signal 1, and a specified amount of the resist is dropped from the nozzle 3 into the pan 7. The solidified resist stuck to the nozzle tip is resolved again, separated, and dropped in the pan 7. Then, the pump 2 is stopped by the signal 1, a mask is absorbed to the rotating support 5 by vacuum, thereafter the nozzle 3 is moved 4 and aligned with the rotating shaft of the support 5. Then, the pump 2 is driven, and a specified amount thereof is dropped, but when the pump is stopped, the nozzle is returned to the original position. Thereafter, the motor 6 is rotated by the signal 1, and application of mask is performed. In this constitution, since the solidified resist or the foreign materials in the resist are not dropped on the substrate or the mask, a high-quality resist film can be applied.
申请公布号 JPS5632724(A) 申请公布日期 1981.04.02
申请号 JP19790107252 申请日期 1979.08.24
申请人 HITACHI LTD 发明人 SATOU NOBUO;MORI YOSHIHARU
分类号 H01L21/027;G03F7/16;(IPC1-7):01L21/30 主分类号 H01L21/027
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