发明名称 Spring contact multipath connectors for telephone equipment - in which ultrasonic deformation of contact springs is used for connector assembly
摘要 <p>The multiway connectors are intended for mounting on rails (2) to form part of a large installation, and for making contact with circuit cards or similar appts. The contact springs (5) are loosely held in a moulded insulation shell (4). At one end they are located by a comb type clamp (10) in their correct working position. The other end, with the solder tags (9), is free, and the position of the ends set by temporary clamps (7) engaging with eyelets (8) in extension lugs (12). When the positions are set, local ultrasonic deformation (11) of the springs holds them securely in the insulation shell (4). The temporary clamps can then be cut off and the assembly made ready for use. The employment of ultrasonic deformation simplifies the manufacturing and assembly process by eliminating a number of hitherto necessary insulation operations.</p>
申请公布号 DE2937102(A1) 申请公布日期 1981.04.02
申请号 DE19792937102 申请日期 1979.09.13
申请人 SIEMENS AG 发明人 PELZL,LEO
分类号 H04Q1/14;(IPC1-7):04Q1/02;01R33/76 主分类号 H04Q1/14
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