发明名称 PROCESS FOR REPORTING A PATTERN ON A SEMICONDUCTOR CHIP
摘要 <p>During manufacturing of semiconductor circuits by photolithography before irradiation of the photographic lacquer (6), there is provided a transparent coating (7) directly on the photographic lacquer. The dust particles are then fixed at a distance from the lacquer layer (6) so that they have a lesser optical effect. By increasing the overall thickness of the layers (6 and 7) which cover the semiconductor, the probability of occurrence of stationary waves is reduced. </p>
申请公布号 WO1981000923(A1) 申请公布日期 1981.04.02
申请号 EP1980000101 申请日期 1980.09.19
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