PROCESS FOR MANUFACTURING PRINTED CIRCUITS WITH METALLISED HOLES STARTING FROM ISOLATED SUBSTRATES HAVING A SYNTHETIC GLASS-RESIN MULTILAYER STRUCTURE

摘要

The present invention relates to a process for producing two-sided printed circuit boards with metal-coated holes from insulating supports made of glass-synthetic resin laminate, in which the holes to be metal-coated are punched through the insulating support, a deposit of conductive metal is effected by chemical metal-coating in the holes and on the two faces, wiring is made by etching the conductive metal on the two faces after having deposited a reserve, then the electrical components are positioned in the metal-coated holes and the tails of the components are soldered in the respective holes to insure the electrical connections. Immediately after the holes have been punched, the support is coated with a positive-action photosensitive resin and the coated support is exposed to a radiation capable of destroying the resin, then it is dried.