LID INTERACTION PROTECTED SHIELD ENCLOSED DIELECTRIC MOUNTED MICROSTRIP

摘要

A shield enclosed microstrip circuit on a rigid relatively thick thermally and electrically conductive ground plane plate with polyolefin dielectric material approximately 0.026 inches thick having a dielectric constant within approximately the 2.3 to 2.5 range and microstrip circuitry in bonded laminate relation. RF microwave absorbent foamed material is supported within the shield enclosure in spaced generally parallel relation from the microstrip circuitry to simulate free space and eliminate "LID" effect over the microstrip circuitry.