| 摘要 |
An improved hermetically sealed semiconductor casing 10 and a process for producing the casing are disclosed. This casing includes a lead frame 14 having an electrical device 12 affixed thereto, A base member 20 is glass bonded to a matching surface of the lead frame. A metal window frame shaped device 26 is provided having one surface 28 with a refractory oxide coating and a second opposite readily solderable surface 30. The refractory oxide layer of the window frame device is glass bonded to the lead frame and the base member 20. The semiconductor or electrical device is connected to the lead frame after the window frame has been glass bonded into place. A metal lid 32 having a solderable surface 34 is solder bonded to the solderable surface of the window frame to hermetically seal the electrical device 12 within the casing. |
