| 摘要 |
In an apparatus for plating the cylindrical flat surface of a metal substrate which is seated in a recess in a substrate case, a shield is mounted on the case around the edge of the surface of the substrate. The shield has an opening therethrough of a diameter adjacent the substrate substantially equal to the diameter of the surface of the substrate, and at the top surface thereof smaller than the diameter of the substrate so as to extend over the substrate. The portion of the opening adjacent the substrate is beveled radially inwardly at an angle of between 45 degrees and 60 degrees.
|
