发明名称 STABILIZED ELECTROLESS PLATING SOLUTIONS
摘要 An electroless plating solution is characterized by the addition of a small but effective amount of a covalent mercury compound to increase bath stability. It is known in the art that solutions for electroless plating are unstable and tend to decompose with use. It is also known that decomposition can be retarded and the useful life of a plating solution increased by the addition of various additives, frequently catalytic poisons, in very small concentrations. In accordance with the present invention, it has been found that the stability of an electroless plating solution can be substantially increased by the addition of a covalent mercury compound alone as a primary stabilizer, or preferably, by the addition of the mercury compound as a secondary stabilizer in combination with a prior art stabilizer as primary stabilizer. The combination of stabilizers provides a synergism with stability substantially improved over that obtainable with either component of the combination alone.
申请公布号 US3649308(A) 申请公布日期 1972.03.14
申请号 USD3649308 申请日期 1970.05.21
申请人 SHIPLEY CO. INC. 发明人 MICHAEL GULLA;OLEH B. DUTKWYCH
分类号 C23C18/34;C23C18/36;C23C18/40;C23C18/50;C23C18/52;(IPC1-7):C23C3/02 主分类号 C23C18/34
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