High current silicon semiconductor cooling system - has wires soldered to metallised islands on surface of silicon disc, extending outwards

摘要

The brush type cooling system for disc-shaped diodes, thyristors and transistors carrying currents of several KA uses copper wires (1) which are soldered to metallised islands (4) spaced along the device. The wires are in parallel having a length between 3 and 20 mm, pref. 10 mm, and a diameter between 0.02 and 0.2 mm. The device is made of silicon. Alternatively, the metallised islands are separated by V-shaped grooves, having a ratio of width to depth of between 1 and 2, e.g. 1.4. The depth is between 5 and 100 microns. Each wire is connected to one island.