| 摘要 |
PURPOSE:To facilitate an easy pattern recognition by an optical reading and contrive the improvement in the accuracy of the position of bonding in a semiconductor container by providing a reference point for positioning a recess hole or the like in the linear bonding region of two or more metallic lead frame. CONSTITUTION:Recess holes 6a, 6b are formed in two linearly bonded regions 5 of lead frame 2 as a reference point for positioning. These holes may be precisely formed simultaneously upon formation of the frame 2, and when the frame 2 is secured to the ceramic bottom plate 1 by lead borosilicate glass 3, no error occurs in positioning it. Accordingly, the coordinates of the region 5 can be stored in a bonding unit, and a precise linear bonding of highly accurate positioning thereof can be carried out. |
