| 摘要 |
PURPOSE:To eliminate retention of deformation of a semiconductor element and of projected burr and pin burr thereof by using the entire bottom surface of a cavity as a knock-out unit. CONSTITUTION:The semiconductor element of a lead frame is retained between cavities 2, upper and lower dies are clamped, are heated, molten resin is introduced into the cavities 2 to be filled therein. After the resin is cured, knock-out unit 7 is projected from the entire bottom surface of the cavities 2 to thus urge out externally the semiconductor element sealed with resin from the cavities 2. Since the semiconductor element is thus urged out upon reception of projecting strses to the entire surface making contact with the knock-out unit 7, locan projecting stress may not be applied to the molded product. Accordingly, the molded product will not be deformed, nor retain projecting burr and pin burr. |
