| 摘要 |
PURPOSE:To enable the convenient and rapid manufacture of an integrated circuit by a method wherein a substrate is absorbed to a suction chuck, the circumference of the substrate is ground to make the axial line of chuck to coincide with the center of substrate and the integrated circuit is provided on the surface of substrate. CONSTITUTION:When a printed wiring processing, for example, is to be performed on a blank substrate like ceramics, silicon, etc., the substrate 12 is made to be absorbed to a suction chuck 7' making the central point to be nearly coincide with an axial line a of the chuck 7'. The long sides of the substrate 12 is ground with grinding machines or abrasive machines 13, then the chuck 7' is made to rotate at 90 deg. and the short sides of the substrate 12 is ground to finish the circumference of the substrate 12 symmetrically in all the directions against the axial line a, and the center point of the substrate 12 is made to coincide with the axial line a. Then print processing is performed on the surface of the substrate 12 with the ordinary method. By this way, the center positioning and the finish processing are performed at the same time, and the integrated circuit can be manufactured conveniently and rapidly. |
