Method of polishing a semiconductor wafer

摘要

A semiconductor wafer (31) is placed on a non-porous, flat, substrate (10), with a thin layer of water (21) interposed therebetween. The substrate (10) with the wafer (31) thereon is placed in a polishing machine (40) where a rotating polishing pad (43) polishes the wafer which is permitted to float free and rotate on the thin layer of water (21) during the polishing operation.