| 摘要 |
PURPOSE:To minimize the chip size by reducing the space occupied by a pad while enabling more elements to be formed on the same chip size by a method wherein a wiring layer exclusive for a bonding pad is provided on the topmost wiring pattern to be connected to circuit element. CONSTITUTION:The peripheral part of a semiconductor substrate whereon semiconductor elements are formed is encircled by an oxide film 6 for element isolation and then wiring patterns 7 comprising Al, polycrystalline Si etc., are fixed to the element provided on the oxide film 6. Besides, the semiconductor substrate is coated with similar wiring pattern 8 through the intermediary of an interlayer film 5 to make openings ; the pattern 8 put by the sides of the patterns 7 is connected to the element through the openings; likewise the patterns 8 is coated with the other wiring pattern 3 through the intermediary of another interlayer film 4 to connect a part of pattern 8 to the pattern 8. Later, overall surface is covered with the other interlayer film 2 to provide a bonding pad 1 on the film 2 to connect the end of the pad 1 to a part of the pattern 3. Through these procedures, the wiring layer 1 exclusive for a pad is provided only on the upper end to simplify the pad constitution. |
