| 摘要 |
<p>PURPOSE:To contrive the reduction in size of a light and electric hybrid integrated circuit and in a mounting cost thereof by optically coupling an IC chip with a light emitting element chip through an optical prism. CONSTITUTION:A light emitting element chip 4 and a photodetector chip 5 are disposed on a same plane. A light 10 from the light emitting surface 8 of the light emitting element chip 4 is introduced through a prism 11 to the light receiving surface 9 of the photodetector 5, and both elements are optically coupled. This configuration can reduce the circuit in size, and can process the semiconductor chip and other IC chip relative to optical coupling through the same step and can simplify the assembling.</p> |
