发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent contact of a coupling wire with the end of a semiconductor element by forming a stepwise difference at the end of an inner lead wire. CONSTITUTION:The stepwise difference 3 is formed so that the end 1 of an inner lead wire is higher than the fixing portion 2 of a semiconductor element. Thus, a fine wire may not make contact with the end of the element. Further, this difference serves as a stopper for removal after sealing the element with resin.
申请公布号 JPS5624960(A) 申请公布日期 1981.03.10
申请号 JP19790100901 申请日期 1979.08.07
申请人 KYUSHU NIPPON ELECTRIC 发明人 KUBO HIROSHI
分类号 H01L23/50;H01L21/60;H01L23/495 主分类号 H01L23/50
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