| 摘要 |
PURPOSE:To contrive the pressure dispersion of a lead frame for a semiconductor device at the time of bonding and to prevent crack thereat by dividing the end of the lead frame into a plurality of segments. CONSTITUTION:A semiconductor substrate 11 is coated on the surface with an insulating film 12, and an aluminum pad 13, a protective film 14, a conductor 15, and a metallic bump 16 are formed thereon. The end of the lead wire 17 making contact with the bump 16 is divided into more than two at the time of bonding it. Since the pressure to be applied to the conductor and the protective film directly under the bump is dispersed at the time of bonding in this configuration, it can prevent the crack and improve the reliability thereof. |
