发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a coupling wire from making contact with the end of a semiconductor element by providing an insulator frame around the periphery of a semiconductor element fixing portion. CONSTITUTION:The insulator frame 5 is formed on the periphery of a semiconductor fixing portion 1 of a lead frame. Thus, a coupling wire 4 may not shortcircuit with the end of the semiconductor element not with the end of the fixing portion, thereby improving the workability.
申请公布号 JPS5624958(A) 申请公布日期 1981.03.10
申请号 JP19790100899 申请日期 1979.08.07
申请人 KYUSHU NIPPON ELECTRIC 发明人 KUBO HIROSHI
分类号 H01L23/50;H01L21/60;H01L23/495 主分类号 H01L23/50
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