发明名称 |
Composition and method for gold plating |
摘要 |
A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of a phosphate electrolyte, 1-hydroxyethylidene-1,1-diphosphonic acid, metal constituent, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.0-13.0 and operated at a current density of 0.1-165 amperes per square decimeter.
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申请公布号 |
US4253920(A) |
申请公布日期 |
1981.03.03 |
申请号 |
US19800132279 |
申请日期 |
1980.03.20 |
申请人 |
AMERICAN CHEMICAL & REFINING COMPANY, INCORPORATED |
发明人 |
FLETCHER, AUGUSTUS;MORIARTY, WILLIAM L. |
分类号 |
C25D3/48;C25D3/62;(IPC1-7):C25D3/48 |
主分类号 |
C25D3/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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