发明名称 Composition and method for gold plating
摘要 A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of a phosphate electrolyte, 1-hydroxyethylidene-1,1-diphosphonic acid, metal constituent, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.0-13.0 and operated at a current density of 0.1-165 amperes per square decimeter.
申请公布号 US4253920(A) 申请公布日期 1981.03.03
申请号 US19800132279 申请日期 1980.03.20
申请人 AMERICAN CHEMICAL & REFINING COMPANY, INCORPORATED 发明人 FLETCHER, AUGUSTUS;MORIARTY, WILLIAM L.
分类号 C25D3/48;C25D3/62;(IPC1-7):C25D3/48 主分类号 C25D3/48
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