| 摘要 |
<p>PURPOSE:To prevent the bursting of an airtight container by repleting an insulating liquid through a pipe for sealing in a container accommodating a semiconductor element wherein the tip of the pipe is sealed under the condition that main electodes are pressed and contacted to both sides of the element. CONSTITUTION:An insulating liquid 13 is depleted in the space in the airtight container of a pressure and contact type semiconductor device 15 before completing an assembly process and sealing the tip of a pipe 8 for sealing. Next, main electrode conductors 2, 3 are pressed by using heaters 18, 19, jigs 16, 17 and the temperature of the semiconductor device 15 is raised by contacting the conductors 2, 3 with the main electrodes 1b, 1d of a semiconductor element 1. A liquid 18 overflows from the pipe 8 by a decrease in the volume in the container and by an expansion in the liquid. When the temperature rises to that at the operation of a device 16, the tip of the pipe 8 is pressed and sealed by jigs 20, 21. In this composition, there is absolutely no possibility of bursting the airtight container even if a pressure mechanism is installed at the outside of the electrode conductor 2, 3 at the time of operation.</p> |
