发明名称 SOLDER FOR ALUMINUM AND ALUMINUM ALLOY
摘要 PURPOSE:To decrease the formation of cavities owing to the gas from flux at the joining and the formation of shrinkage cavities at the overheating by adding a small amount of Cr to a Zn-Al-base high melting point solder. CONSTITUTION:This solder for Al and Al alloy contains 3-7% Al and 0.2-3% Cr and comprises high purity Zn of >=99.99% for the remainder. this solder is able to considerably decrease the formation of cavities oxing to the gas from flux particularly in the joining by using a flux and the formation of shrinkage cavities at the overheating.
申请公布号 JPS5619998(A) 申请公布日期 1981.02.25
申请号 JP19790095819 申请日期 1979.07.27
申请人 FURUKAWA ALUMINIUM 发明人 ISHIKAWA KAZUNORI
分类号 B23K35/28;C22C18/00 主分类号 B23K35/28
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