发明名称 |
Apparatus for bonding leads to semiconductor chips |
摘要 |
In the bonding apparatus disclosed herein, possible misalignment of a semiconductor chip at the work station is sensed by first optically scanning the workpiece using a video scanning head mounted on a common X-Y carriage with the bonding head. A zone signal is generated which defines, within the scanned area, a limited zone of consideration. The video signal is evaluated as a function of the zone signal to measure the extent of coincidence between the zone and a target area on the workpiece. The placement and dimensions of the zone are progressively adjusted responsive to the evaluation and in accordance with a search algorithm to locate at least two target areas on the workpiece and the bonding head is then traversed to adjusted target coordinates derived from the optically located target areas.
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申请公布号 |
US4253111(A) |
申请公布日期 |
1981.02.24 |
申请号 |
US19780945710 |
申请日期 |
1978.09.25 |
申请人 |
GCA CORPORATION |
发明人 |
FUNK, ERNEST J.;UNION, RUSSELL;PRATT, MARGARET M. |
分类号 |
G06T1/00;H01L21/00;H01L21/68;(IPC1-7):H04N7/18 |
主分类号 |
G06T1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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