| 摘要 |
PURPOSE:To enhance light scattering property in sealing a solid semiconductor element by using resin by carrying out curing by using transparent resin in which powder is filled, then by etching a portion of the surface by using solvent which resolves the filling agent. CONSTITUTION:A light emitting element 1 is fixed to one of the two leads 2, and an electrode which is provided on said element 1 is connected to the other lead 2 by using a thin metal wire 3. Then, the tips of the leads and the element 1 are sealed by using resin 4, which contains powder. That is, the transparent resin 4 is composed of alicyclic epoxy resin, hexahydrophthalic acid, tertiary amine, and the like. In said resin, silica powder whose average diameter of the particles is 0.03mum is blended. The resin 4 is formed and then cured. Thereafter, the resin 4 is immersed in solvent of hydrofluoric acid of 50% for about 1min, the powder on the surface layer is resolved, and the surface is roughened. In this method, light scattering property becomes excellent, and the loss in the amount of the effective light is remarkably decreased. The alumina powder can preferably be used. |
